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ECG005
Product Features
* DC - 4 GHz * +18 dBm P1dB at 1 GHz * +34 dBm OIP3 at 1 GHz * 22.1 dB Gain at 1 GHz * 3.3 dB Noise Figure at 2 GHz * Available in Lead-free / green SOT-89 Package Style * Internally matched to 50
InGaP HBT Gain Block
Product Description
The ECG005B is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 1000 MHz, the ECG005B typically provides 22.1 dB of gain, +34 dBm Output IP3, and +18 dBm P1dB. The ECG005B consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in a lowcost, surface-mountable lead-free/green/RoHS-compliant SOT-89 package. All devices are 100% RF and DC tested. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the ECG005B will work for other various applications within the DC to 4 GHz frequency range such as CATV and mobile wireless.
Functional Diagram
GND 4
1 RF IN
2 GND
3 RF OUT
Applications
* * * * * Mobile Infrastructure CATV / FTTX W-LAN / ISM RFID WiMAX / WiBro
Function Input Output/Bias Ground
Pin No. 1 3 2, 4
Specifications (1)
Parameter
Operational Bandwidth Test Frequency Gain Output P1dB Output IP3 (2) Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current
Typical Performance (1)
Units
MHz MHz dB dBm dBm MHz dB dB dB dBm dBm dB V mA
Min
DC
Typ
1000 22.1 +18 +34 2000 21.4 19 11 +17.5 +32 3.3 4.8 65
Max
4000
Parameter
Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure
Units
MHz dB dB dB dBm dBm dB 500 22.4 -28 -22 +17.8 +33 5.2
Typical
900 22.2 -25 -18 +18 +34 3.4 1900 21.5 -20 -11 +17.5 +32 3.3 2140 21.3 -18 -10 +19.0 +30.5 3.8
19.8
22.8
+16.5 +30 4.2
5.3
1. Test conditions unless otherwise noted: 25 C, Supply Voltage = +6 V, Rbias = 18 , 50 System. 2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Operating Case Temperature Storage Temperature Device Current RF Input Power (continuous) Junction Temperature
Rating
-40 to +85 C -55 to +150 C 130 mA +12 dBm +250 C
Ordering Information
Part No.
ECG005B-G ECG005B-PCB
Description
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 package)
700 -2400 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
Operation of this device above any of these parameters may cause permanent damage.
WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com
Page 1 of 4 April 2007
ECG005
Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +6 V, Rbias = 18 , Icc = 65 mA
MHz dB dB dB dBm dBm dB 100 22.5 -29.5 -31 +17.5 +33.6 5.4 500 22.5 -28 -22 +17.8 +33.5 5.3 900 22.2 -25 -17.5 +18 +34 3.5 1900 21.5 -19.5 -11.2 +17.6 +32 3.3 2140 21.3 -18 -10.3 +17.3 +31.5 3.3 2400 21.1 -16.9 -9.5 +17.1 +31 3.3 3500 20.2 -14.2 -6.7 +16 5800 17.2 -8.2 -3
1. Test conditions: T = 25 C, Supply Voltage = +6 V, Device Voltage = 4.8 V, Rbias = 18 , Icc = 65 mA typical, 50 System. 2. 3OIP measured with two tones at an output power of +4.5 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Small Signal Gain
25
0 Return Loss (dB) -5 -10 -15 -20 -25 -30 0.5
S11 & S22 25C
Icc vs Vde 160 140 120
Icc (mA)
23 Gain (dB) 21 19 17 15 0.5
100 80 60 40 20 0 25C
25C
-40C
85C
S11
S22 2.5
1
1.5 Frequency (GHz)
2
2.5
1.5 Frequency (GHz) Noise Figure vs. Frequency
0
1
2
Vde (V)
3
4
5
6
OIP3 vs. Frequency 40 35 OIP3 (dBm) 30 25 25C 20 0.5 1 -40C 1.5 Frequency (GHz) 85C 2 2.5 2 0.5 NF (dB) 6 5 4 3
P1dB vs. Frequency 24
P1dB (dBm)
20
16 25C -40C 85C 2 2.5
1 1.5 Frequency (GHz)
2
12 0.5
1
1.5 Frequency (GHz)
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 2 of 4 April 2007
ECG005
InGaP HBT Gain Block
Recommended Application Circuit
Vcc Icc = 65 mA
R4 Bias Resistor C4 Bypass Capacitor C3 0.018 F L1 RF Choke RF IN ECG005 C1 Blocking Capacitor C2 Blocking Capacitor RF OUT
Reference Designator L1 C1, C2, C4
50 820 nH .018 F
Recommended Component Values Frequency (MHz) 500 900 1900 2200 220 nH 68 nH 27 nH 22 nH 1000 pF 100 pF 68 pF 68 pF
2500 18 nH 56 pF
3500 15 nH 39 pF
1. The proper values for the components are dependent upon the intended frequency of operation. 2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig. L1 C1, C2 C3 C4 R4
Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 F chip capacitor Do Not Place 18 1% tolerance
Size 0603 0603 0603 0805
Recommended Bias Resistor Values Supply R1 value Size Voltage 6V 18.5 ohms 0805 7V 33.8 ohms 1210 8V 49 ohms 1210 9V 65 ohms 2010 10 V 80 ohms 2010 12 V 111 ohms 2512
The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +6 V. A 1% tolerance resistor is recommended.
Typical Device S-Parameters
S-Parameters (Vdevice = +4.8 V, ICC = 65 mA, T = 25C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000
-33.81 -34.12 -25.88 -21.94 -19.63 -16.68 -15.77 -14.11 -12.65 -11.49 -9.97 -8.98 -8.12
-161.46 -135.89 -122.57 -136.54 -145.42 -165.15 177.44 162.19 141.66 120.75 99.89 80.49 62.50
22.53 22.36 22.10 21.80 21.49 21.20 20.74 20.26 19.76 19.19 18.51 17.58 16.79
177.86 159.30 138.63 119.41 99.88 80.49 61.36 42.76 23.27 4.28 -15.13 -33.50 -51.89
-24.24 -24.29 -23.67 -23.50 -23.04 -22.91 -22.48 -21.95 -21.02 -21.18 -20.97 -20.43 -20.38
0.19 -5.13 -9.76 -15.45 -19.26 -25.61 -34.76 -42.47 -51.88 -58.92 -70.63 -80.16 -94.99
-29.52 -21.96 -16.38 -13.06 -10.90 -9.14 -7.57 -6.61 -5.50 -4.66 -4.16 -3.60 -3.03
-10.77 -80.32 -110.06 -132.72 -153.43 -172.26 170.00 150.90 133.37 115.20 94.80 77.20 60.86
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 3 of 4 April 2007
ECG005
InGaP HBT Gain Block
ECG005B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded (maximum 245 C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an "E005G" designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is marked with an "E005" designator followed by an alphanumeric lot code; it may also have been marked with a "F" designator followed by a 3-digit numeric lot code. Tape and reel specifications for this part are located on the website in the "Application Notes" section.
MSL / ESD Rating Land Pattern
ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature Thermal Resistance, Rth
Rating
-40 to +85 C 128 C/W
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 4 of 4 April 2007

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